| COMPANY |
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Incorporated in September 2004, Semitech Innovations Global is committed to providing freedom of choice to companies world-wide in managing their networks in the AMR, Home Automation and Industrial Automation industries.
The company has spent three years and US$6 Million in developing a state-of-the art smart chip and a suite of software application that clearly differentiates itself form current players in the industry.
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The company is well advanced in its commercialization process having previously achieved commercial success in the toy and mobile telecommunication industries. Solutions includes voice recognition chips for the Korean and Chinese toy markets and an Analogue-Digital Converter (ADC) chip for use in mobile phone applications. |
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The company has experienced management and staff with longstanding industry relationships and the requisite technical and commercial skills. The company currently employs 25 engineers and 15 business and marketing staff in its three operations in Melbourne, Australia, Singapore and Xian China. Key management personnel include Mr. Stephen Moo Kim who is the Chairman, Board member and CEO of the STA group of companies including its branch in Singapore, Semitech Innovations Global Pte Ltd. |
| VISION |
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To Seemlessly Move Data across Networks and Provide Freedom of Choice to our customers in the AMR, Home Automation and Industrial Automation segments. |
| OBJECTIVES |
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SEAMLESSLY |
| ONGOING
RESEARCH |
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The
current STALON design allows applications in the three market
segments discussed in this document, and the initial research
planned for the coming 12 month period will focus on developing
applications specific to customer integration of STALON. STA
intends to maintain its capacity to continue its research and
development in terms of improving the existing product STALON
as well as adapting for new applications |
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In
addition, the design methodology incorporated in the STALON
design includes a "modular footprint" concept, which permits
future developments, improvements and additional technologies
to be incorporated without the necessity of redesigning the
entire chip layout, functionality or core technology. |
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By
way of example, the current chip design permits data transmission
in an extremely reliable and verifiable format for use within
the targeted first markets. Future chips may include protocols
allowing broadband speed by way of compression or additional
technologies and functions. |
